Printable Materials with Embedded Electronics and Radio Frequency Components
Award amount
$155,000Program and phase
SBIR · Phase IAward year
2016Award details
- Awarding agency
- Department of Defense
- Branch
- Army
- Recipient company
- ENGENIUSMICRO LLC
- Proposal award date
- 2016-09-15
- Contract end date
- 2017-12-09
- UEI
- JF8WG2W8RR53
- Solicitation number
- 2016.1
- Topic code
- A16-006
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Additive Cofired Ceramic Electronics for Space Systems (ACCESS)
- Additive Manufacturing Tools for Reverse Engineering?
- Manufacturing Innovations for Next-gen Technologies in hypersonic vehicles (MINT)
- Tethered Drone RF Optimized Nodal Element (T-DRONE)
- Compact Metamaterial-Enabled High Power Microwave Antennas
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Additively Manufactured Radomes
- Low-SWAP-C, Radome-Integrated Printed Antennas for Hypersonic Weapons (1000-550)
- Printable Materials with Embedded Electronics and Radio Frequency Components
- Printable Materials with Embedded Electronics and Radio Frequency Components
- Printed Materials with Embedded Electronics and Radio Frequency Components (1000-409)
Research funding history
58 SBIR/STTR records share this UEI (2007–2025). Reported award amounts total $26,395,686. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Science Foundation, National Aeronautics and Space Administration, Department of Energy