Wireless Sensor Piconet Radio (WiSPiR)

We propose to develop a suite of wireless interconnect modules and the associated technologies. The interconnect technology will be designed with radiation tolerance in mind for space use but may also be applicable to aviation. The topology will be flexible enough to support the needs of both low rate, low power nodes, as well as high speed, higher power nodes. Our proposed architecture is modeled after the Aerospace Vehicle Systems Institute?s (AVSI) Wireless Avionics Intra-Communications (WAIC). Power estimates range from 100 mW while active for those nodes connecting to sensors/actuators, and 1 W while active for those operating as masters on their scatternet. The volume estimate for all nodes is currently approximately 1.75 cm^3, with a maximum linear dimension of 25 mm, including shielding. External components are minimized through clever use of printed circuit board technology.