Complex Electronic Assembly Cleanliness Requirements
Award amount
$911,354Program and phase
SBIR · Phase IIAward year
2015Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- STI ELECTRONICS INC
- Proposal award date
- 2015-05-11
- Contract end date
- 2017-05-13
- UEI
- DNLMSSK7HQJ6
- Solicitation number
- 2013.2
- Topic code
- MDA13-030
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Advanced Packaging Concept: Imbedded Component/Die Technology (IC/DT)
- Integrated Avionics Manufacturing Concept: Imbedded Component/Die Technology (IC/DT)
- Innovative Manufacturing Process Improvements
- Advanced, Low Cost, Integrated Avionics
- Integrated Avionics Manufacturing Concept: Imbedded Component/Die Technology (IC/DT)
Research funding history
8 SBIR/STTR records share this UEI (2005–2015). Reported award amounts total $4,201,549. Reported amounts are not federal obligations.
Phases: Phase II, Phase I
Agencies: Department of Defense