Integrated Avionics Manufacturing Concept: Imbedded Component/Die Technology (IC/DT)

The need for increased reliability coupled with reduced size and weight has demanded the evolution of manufacturing process technologies for printed circuit board assembly. Imbedded Component/Die Technology (IC/DT) will advance electronics packaging to the next level by transforming two-dimensional component placement into a three-dimensional (3-D) assembly with integrated thermal management. IC/DT enables the 3-D configuration of multiple systems thus achieving the cost/weight ratio advantage of using the smallest form and fit factor components available in a circuit card assembly. The objective of this research project is to develop a conceptual design using IC/DT to improve component performance, system capability, and product reliability of advanced interceptor seeker electronics. Removal of component-level packaging reduces assembly weight, electrical failure opportunities, electrical and thermal impedance, and valuable circuit card real estate. In Phase I, a manufacturing and assembly design methodology will be developed to integrate multiple advanced interceptor seeker electronics, such as the seeker IMU and image processor, into a high-density, miniaturized, light weight assembly. In collaboration with LMSSC, MSSA, and IBSi, a low-cost, highly-integrated, high-performance avionics package for the MKV kill vehicle shall be developed. This design methodology may be applied to a myriad of military interceptor products.