Advanced, Low Cost, Integrated Avionics

Imbedded Component/Die Technology provides a complete solution for mission critical electronics coupling high-density electronics with passive thermal management. Imbedded Component/Die Technology allows the 3-D configuration of multiple systems thus achieving the cost/weight ratio advantage of using the smallest form and fit factor components available in a circuit card assembly. The objective of this research project is to continue development of a miniaturized, lightweight system for integrated seeker electronics using IC/DT. In Phase I, a conceptual design of a miniaturized SPAR-X electronics assembly was proposed producing a smaller, denser, more robust assembly with integrated, passive thermal management. Utilizing bare die reduces weight, electrical failure opportunities, electrical and thermal impedance, and valuable circuit card real estate allowing the population of additional components within the same envelope or a design shrink for smaller vehicles. Phase II will entail a redesign of the SPAR-X electronics system using IC/DT to exploit the benefits of unpackaged components namely bare die. The SPAR-X assembly shall be designed and manufactured resulting in an engineered prototype as a proof of principle demonstration.