Laser Transmitter Module with Integrated Thermal Management System

ABSTRACT: NexGenSemi Corporation will explore the feasibility to develop GNR heat pipes as an integrated cooling system to thermally managing'hot spots'associated with high power solid state laser components that can be readily integrated into a UAV and/or satellite payload to provide reliable, high-data-rate optical communications over the entire mission life of a communications satellite. The goal is to use Digital Beam Processing (DBP) methods to manufacture patterned arrays of GNRs to maximize heat conductivity to dissipate heat from laser modules. By milling the semiconductor substrate and patterning the GNR heat pipes we will make use of most efficient graphene-substrate interface to maximize heat conductivity; thereby, extending the lifetime and increasing performance of the laser. In Phase I we will perform lifetime experiments of the laser transmitter with the GNRs to aid the conductivity of heat away from the device, and compare to device performance without the GNRs in order to qualify our hypothesis. Phase I will enable us to establish a figure of merit for the lifetime of the laser transmitter, and validate thermal management via GNR heat pipe design to provide a basis for the realization of a prototype device. BENEFIT: The NexGenSemi Corporation/Sandia team is presenting process technology for manufacturing efficient heat sinks using graphene nano-ribbon devices based on custom edge termination profiles of patterned GNRs using DBP methods. Realization of these new heat sinks made from single layer graphene will have many commercial applications due to their high reliability, non-fouling of the environment during operation, and as a renewable energy source. GNR based thermoelectric film devices are ideal for applications like on-chip heat recovery, cooling, and power generation, alternative energy sources, heat flux sensors, and fluid flow sensors. A successful outcome on this program will help find a solution to the current challenges for producing highly efficient thermoelectric generators using available bulk materials and standard CMOS microelectronics processing in large volumes. NGSC"s has the unique ability to pattern the substrate-graphene interface to allow for maximum heat conduction away from the device. Also, NGSC has the ability to etch the graphene sheet to engineer the GNRs design to allow for well-defined edges and precise dimensions to maximize the heat conduction. The purpose of this topic is to utilize nano-technology to solve the design will satisfy the requirements of being cost effective while minimize weight, power and size impacts to UAV and/or satellite payloads.