SBIR/STTR Research Award
Advanced Microelectronic Manufacturing Program (AMMP)
Award amount
$749,573Program and phase
SBIR · Phase IIAward year
2019Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- NEXGENSEMI CORPORATION
- Proposal award date
- 2019-05-30
- Contract end date
- 2021-05-30
- UEI
- GQSJQMBAEJ79
- Solicitation number
- 12.3
- Topic code
- MDA12-035
Research abstract
NexGenSemi Corporation develops advanced semiconductor manufacturing technology for tomorrow’s leveraged electronics. The company is proposing the development of a novel layer-by-layer patterned growth from direct digital design for semiconductor electronics manufacturing. The material growth technology is a modified heterogeneous patterned nucleation deposition process which is key to manufacturing electronics in a single prototyping system. The novelty is a 10,000x manufacturing improvement rate leading to quick turn prototype and pilot production semiconductor manufacturing. The program has defined objectives and goals outlined to meet commercialization standards to successfully integrate the technology into industry.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Additive Manufacturing Rad Hard Microshields (AMRM)
- 3D Printed Microscale Radiation Shield
- Resonating Acoustic Vector Integrated Nanoribbon (RAVIN)
- Materials and Life Cycle Sustainability
- Advanced Integrated Circuit Anti-Tamper Methods
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
Research funding history
13 SBIR/STTR records share this UEI (2009–2023). Reported award amounts total $3,518,921. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense