Additive Manufacturing Rad Hard Microshields (AMRM)

Strategic Systems Programs (SSP) needs a cost-effective approach to field an FPGA that both address hardware assurance concerns and can meet the objective radiation requirements detailed in request for proposal (RFP) CS-22-1301 to be used in strategic weapons systems.  The current approach is a redesign which is a costly, muti-year re-design and verification resource consuming cycle to protect against potential subversion.  The DoD seeks the ability to meet radiation-hardened requirements while shorten the design cycle and provide rapid digital flight hardware electronics upgraded solutions. The topic seeks additional solutions outside the RHBD and RHBP methods listed. NexGenSemi proposes the investigation of a new type of rad-hard shielding material with an integrated application strategy to meet, mitigate and test the objective requirements outline.  The phase I will extend MS&A radiation exposure properties of the material and define the phase II application and testing to verify performance as well as outline the chip supply execution path using this new novel material.