Conductive Grid Application to Hemispherical Optical Components

Transparent domes for multimode seeker technology are currently being developed. Part of that development involves the integration of a fine metal grid for EMI shielding. The shape of the parent dome and the specific requirements for the width and spacing of the grid lines significantly limit the available methods for fabrication. Photolithography has been successfully utilized to produce this grid, however, other processing options with greater flexibility, lower cost, and better manufacturability are sought. We propose herein to develop a direct write grid application method, suitable to achieve the electrical requirements of the application, as well as the down-stream processing routes currently under development. The proposed method will overcome prior issues by providing the opportunities of a wide conductor material choice, as well as variable line thickness capability. Our proposed efforts build on prior and current experience with photolithography, laser methods, and direct write methods that have been, or are being evaluated for this application. Gridded coupons and partial domes will be demonstrated in Phase I. A fully gridded 7” hemispherical dome will be produced by the end of the Phase I Option.