SBIR/STTR Research Award
Direct Die Attached CTE Matched Ultra High Thermal Conductivity Graphite/Aluminum Heat Sinks for High RF Power Density Phased Array Radar Systems
Award amount
$99,999Program and phase
SBIR · Phase IAward year
2008Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- WMK TECHNOLOGIES, LLC
- Proposal award date
- 2008-04-09
- Contract end date
- 2008-09-10
- UEI
- Not reported
- Solicitation number
- 2007.3
- Topic code
- MDA07-034
Research abstract
A new metal matrix composite material consisting of natural graphite particulates processed into a designed reinforcement architecture that, after pressure infiltration casting with molten Al alloy, results in materials with thermal conductivity (TC) controllable over a range of 600 to 750 W/mK and thermal expansion controllable over the range of 7 to 3 ppm/K. This material, with strategically located high TC “z” inserts is proposed as base plate heat sinks for advanced GaN based phased array radar systems. The material system will be fully characterized. FEA thermal models will be developed for a 4 by 4 channel prototype array which will be manufactured for attachment to T/R module emulators and evaluated by a prime contractor partner for thermal performance. The goal is to enable a two- to three-fold increase in power density in wide bandgap semiconductors and to manufacture radar arrays with greater than 100 channels within essentially a page sized format. The constituent materials are inexpensive. Hence, the proposed technology, at the proper manufacturing scale will provide materials with a cost per unit volume less than copper at 1.5 to 2 times the thermal performance and CTE matching to the T/R module.
Technology keywords
Not reported
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Novel HEMT based on GaN on Diamond for High Power Amplifiers
- Novel HEMT based on GaN on Diamond for High Power Amplifiers
- Device Level Thermal Management Solutions for Phased Array Rada
- Integration of Bulk GaN with Diamond for Device-level Thermal Management Solutions