SBIR/STTR Research Award

A Reliable Electronic Package for Space Exploration

Award identifier c832e2830ecdda3202ad28723a878025eb40457b17b24d517d39436d869679ddAwarding agency National Aeronautics and Space Administration

Award amount

$100,000

Program and phase

SBIR · Phase I

Award year

2008

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
SIENNA TECHNOLOGIES, INC.
Proposal award date
2008-01-25
Contract end date
2008-07-24
UEI
W8VZALJ8J617
Solicitation number
Not reported
Topic code
X1.03

Research abstract

The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes to assemble the components into a hermetically sealed package will be identified and developed. Process and materials capability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module test vehicle.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

61 SBIR/STTR records share this UEI (1993–2017). Reported award amounts total $13,380,891. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, National Science Foundation

Agency intelligence

National Aeronautics and Space Administration

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