SBIR/STTR Research Award
Ultra-Dense Three-Dimensional Electronics for Space
Award amount
$99,986Program and phase
SBIR · Phase IAward year
2008Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- R3LOGIC, INC.
- Proposal award date
- 2008-01-15
- Contract end date
- 2009-01-15
- UEI
- Not reported
- Solicitation number
- 2007.3
- Topic code
- AF073-099
Research abstract
R3Logic, Inc., in collaboration with Tezzaron Semiconductor will develop a rad-hard multi-core embedded processor / memory system that will be fabricated in a multi-layer 3-D integrated circuit. Phase I will focus on the system design. We will complete the RTL to GDSII synthesis of the processor and system components. The stack will incorporate Tezzaron’s patented 3-D Octopus memory, which has built-in self-test and repair capability. In Phase II we will use Tezzaron’s 3-D process to fabricate a prototype device.
Technology keywords
Not reported
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
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- Integrating Field Programmable Passive and Gate Arrays (Passive Brick Concept)
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- Ultra-Dense Three-Dimensional Electronics for Space