Resistless Fabrication and Radiation Characterization for Microelectronics with less than 65 nanometer Features

NexGenSemi Holding Corporation dba “Digibeam” will design and fabricate a minimal assembly for conceptual demonstrate of intermediate throughput semiconductor manufacturing using Digital Beam Processing (DBP). DBP is a modified resistless, maskless manufacturing technique (compliant to Executive Order 13329) that can be performed within a single cluster tool. Our plan is to introduce this disruptive technology that will allow a paradigm shift in manufacturing of integrated micro and nano electronics. This technology will eliminate the necessity for costly manufacturing facilities and significantly change the metrics in start-up costs for the industry. Digibeam founders are the first and only to perform resistless, maskless patterned processing on the entire wafer level. Our complementary experience in the manufacturer of high-end semiconductor equipment makes us uniquely qualified to design and develop first article system to deliver the technology from exploratory development to commercialization. The technology is ideal to simulate cross sectional exposure SEE effect for insitu Radiation Hardened testing. The result of this Phase II effort will be the construction of the alpha prototype to meet all requirements as outlined in the SBIR topic and provide an option to validate simulated energy cross sectional exposure SEE effects on semiconductor devices.