Resistless Fabrication and Radiation Characterization for Microelectronics with less than 65 nanometer Features

NexGenSemi Holding Corp "DBA" DIGIBEAM will outline a feasibility study to perform medium to high-speed throughput semiconductor manufacturing with Digital Beam Processing (DBP). DBP is a modified resistless, maskless manufacturing technique (compliant to Executive Order 13329) that can be performed within a single cluster tool. Our plan is to introduce a disruptive technology that will allow a paradigm shift in manufacturing of integrated micro and nano electronics. This technology will eliminate the necessity for costly manufacturing facilities and significantly change the metrics in start-up costs for the industry. The founders of DIGIBEAM are the first and only to perform resistless, maskless patterned processing on the entire wafer level. Our complementary experience in the manufacturer of high-end semiconductor equipment makes us uniquely qualified to perform a feasibility study to deliver the technology from exploratory development to commercialization. The result of this Phase I effort will be a feasibility study and test plan for critial subsystems to meet all requirements as outlined in the SBIR topic.