Radiation Hardened By Design Structure ASICs for Reliable Digital Components
Award amount
$99,999Program and phase
SBIR · Phase IAward year
2006Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- MICROELECTRONICS RESEARCH DEVELOPMENT CORPORATION
- Proposal award date
- 2006-03-21
- Contract end date
- 2006-09-22
- UEI
- M2WCCD39B593
- Solicitation number
- 2005.3
- Topic code
- MDA05-029
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Low Cost Methodology to Radiation Hardening of Legacy Integrated Circuits
- Low-Cost, Quick-Turn Radiation Tolerant Encryption Engine
- Innovative Mitigation of Radiation Effects in Advanced Technology Nodes
- Double Data Rate 3 Controller for Use in Radiation Environments
- An AMBA-Compliant, Radiation Tolerant Tensor Core for Use in A.I. Applications
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Radiation Hardened By Design Structured ASICs for Reliable Digital Components
- Radiation Hard Electronic Components: Multiple 180nm RH circuits and TCV’s via Texas Instruments for incorporation by Rockwell Collins
- Radiation Hard Electronic Components (Sierra)
- Rad-Hard 20 Msps 14 bit Analog to Digital Converter based-on Schottky Barrier CMOS Technology
Research funding history
45 SBIR/STTR records share this UEI (2006–2019). Reported award amounts total $31,438,573. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration