Radiation Hard Electronic Components (Sierra)

Silicon Space Technology (with Harris and LSI Logic) proposes to demonstrate innovative RH enhancement of an ASIC component, using improved RH manufacturing technologies, capable of reliable operation in the BMDS for its projected mission life. Specifically, we will develop a scaleable Sierra II Cryptographic Processor using 180 nm technology enhanced by SEE and TID mitigation process modules supporting radiation-hardening of components fabricated in commercial silicon foundries. Extensive modeling and simulation will demonstrate performance and radiation hardness in Phase I. Our team's expertise in commercial process integration, device development in leading-edge commercial technology, and radiation-hardening techniques using HBP technology is crucial to successful implementation of the radiation-hardened process modules. Silicon Space's HBI approach, combined with leading-edge silicon foundry manufacturing, creates a practical means to develop digital and analog electronic components capable of reliable operation in BMDS space and interceptor environments. The goal is achieving near-current-commercial product performance capable of surviving SEE and TID. This program will allow rapid transition of the results into systems and subsystems being developed for the BMDS. Leading-edge CMOS foundries producing these products will achieve the previously unattainable goal of deploying the latest electronics while minimizing risk of mission failure due to space radiation.