Novel Low-cost Methods for Fabricating Compact, Vertically Integrated MEMS

Sensorcon is proposing a CMOS compatible method to vertically integrate MEMS devices in a 3D manner, at the wafer level. This method will enable low cost production in both low and high volumes, as the benefits of both SOC and SIP approaches will be realized. The techniques used in this proposal draw upon the state-of-the-art in semiconductor, MEMS, and packaging technologies. Phase I work will demonstrate feasibility by fabricating and testing vertically integrated MEMS (or VI-MEMS) test devices from silicon. The low cost processing methods will be further enhanced by a parallel study with Quantum Leap Packaging, Inc., using Liquid Crystal Polymer (LCP) based MEMS cap wafers as a replacement for today's standard glass & silicon based cap wafers. The feasibility study will be based on results from mechanical, electrical, and hermetic testing, both before and after temperature cycling. Phase II will build on Phase I results by fabricating & testing functional VI-MEMS prototypes. Phase III work will be focused on ramping up production of devices using Phase I & II technologies.