Nanofiber Membrane Processing for Individual Protection Against Chemical-Biological Threats

The proposed R & D is the Phase II technical development of high power and high power density packaging for high power MCM and integrated 3D network microchannel heat sink using dvanced mateials of AlN and Al/SiC MMC composite. The proposed 3D networkmicrochannel heat sink will demonstrate the important characteristics of low thermal resistance (as low as 0.02 W/cm2) and low hydraulic pressure drop (below 40 psi). It is intended to utlize and integrate the existing vehicle engine coolant so that thethe cooling system can be simpler with a light weight and less space taken up by the system. With this proposed desgin, there will be a cost saving in fabrication and operation. These packages will be used with either Si, SiC and/or the mix of these twodevices. A finite element analysis technique will be extensively used for various simulations of heat transfer, fluid flow and temperature distributions as well as the thermal stress in the package.