Multicolor VLWIR 3-D Stacked Integrated Focal Plane and Filtering Architectures

"Computational Sensors Corporation (CSC) plans to seamlessly integrate analog sensor arrays and existing digital technology in a 3-D multi-chip (layer) configuration using massively parallel 3-D focal plane interconnection technologies that are nowavailable. This will provide continuous dataflow between sensor arrays and image processing arrays, creating an entirely new paradigm for analog image processors. The proposed effort will examine the potential to incorporate multicolor processing into thisnew paradigm.Multi-color infrared focal plane array (IRFPA) processing can potentially exploit the phenomenology of an exo-atmospheric boosting target to provide a discriminant based on emissivity. The system is tuned to extract and track the range of emissivitiescorresponding to potential targets and to produce synthetic images for use in tracking algorithms.The Phase I effort will assess potential layered VLSI analog image processing architectures which will be used to apply emissivity-based synthetic imaging to multicolor IRFPA sensor data. It will provide candidate design concepts and performancespecifications supporting the manufacture of hardware under an anticipated Phase II design effort. Multicolor processing provides a capability to use VLWIR sensing for cold body detection by providing a means to eliminate intensity variations due to emissivity variation with wavelength.. This is an especially important for the mid course detecti