Advanced Cryopackaging For the Application of Superconducting Digital Electronics in High Speed Instrumentation

132 Advanced Cryopackaging For the Application of Superconducting Digital Electronics in High Speed Instrumentation--Hypres, Inc., 175 Clearbrook Road, Elmsford, NY 10523-1109; (914) 592-1190 Dr. Raphael Robertazzi, Principal Investigator Dr. Elie K. Track, Business Official DOE Grant No. DE-FG02-97ER82394 Amount: $74,995 High speed measurements in high energy and nuclear physics experiments demand ever-increasing performance of electronic instrumentation. Because measurements in this field are typically performed at the limit of technical feasibility, a new capability in instrumentation can often lead to important new scientific findings. Superconducting electronics offers the potential of performance unattainable by any other technology. However, at the present time a technology for automatically preparing a superconducting circuit for use does not exist. Such a technology is essential for the application of superconducting integrated circuits in real world applications. This project will provide high performance packaging for high speed superconducting components that are currently under development under various contracts with the DOE. The first modules developed under this program will be used in demonstrations of the superconducting electronics now under development for DOE laboratories, such as time to digital converters (TDC). In Phase I a cryoprobe which allows automated degauss of the chip module and deflux of the superconducting integrated circuit will be developed and tested. In Phase II this packaging will be extended to create a multipurpose packaging system for superconducting electronics instrumentation. Commercial Applications and Other Benefits as described by the awardee: The development of a compact package/VME interface for superconducting electronic instrumentation is expected to benefit all particle detectors that could utilize high speed superconducting electronics. The proposed packaging scheme will allow simple, automated setup of highly specialized superconducting electronics. The proposed packaging scheme will allow simple, automated setup of highly specialized superconducting electronics, such as Time-to-Digital (TDC¿s) converters and flash Analog-to-Dial (A/D) converters (A/D¿s). Any application requiring ultra high performance superconducting electronic instrumentation would benefit from this packaging technology.