Dual Band IR FPA Contract Manufacturing

With the U.S infrared focal plane array (FPA) supplier market dominated by large defense Prime contractors, the adoption and wide proliferation of new FPA technologies, such as high-definition dual-band mid-wave and long-wavelength infrared is limited due to source availability and high costs. We offer an innovative program plan and manufacturing model to address these limitations. In this program, ArcNano will demonstrate Third Generation Forward Looking Infrared (3GEN FLIR) performance objectives using commercially supplied strained layer superlattice (SLS) detector epitaxy and digital pixel readout circuits (ROICs) in the two mainstream infrared industry dual-band detector architectures used by RTX and L3Harris (single contact interconnect per pixel) and Leonard DRS (two contact interconnect per pixel). The ArcNano approach is to produce sensors on a contract manufacturing basis across all defense Prime contractors or federal funding agencies. This production model decouples the cost and technology development of FPA’s delivered into DoD programs into distinct, visible units that can be independently addressed for cost reduction and technology advancement.