Modular and Conformal System-on-Foil Packaging Platform for Heterogenous Integration
Award amount
$1,249,709Program and phase
SBIR · Phase II – Direct to Phase IIAward year
2023Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- LUX SEMICONDUCTORS, INC
- Proposal award date
- 2022-10-24
- Contract end date
- 2024-07-25
- UEI
- FF9VAZLAJF92
- Solicitation number
- X22.4
- Topic code
- X224-ODCSO1
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Advancing the Manufacturing Readiness of Smart Substrates for System-on-Foil Advanced Packaging
- System-on-Foil Electronics for Radiation Tolerant Space Computing
- System-on-Foil Electronics for Radiation Tolerant Space Computing
- System-on-Foil Electronics for Conformal RF Antenna Arrays
- SBIR Phase II: Roll-to-Roll Manufacturing of Highly Crystalline Thin Film Semiconductor Substrates for Flexible Electronics
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Fueling the Mission with Bioenergy Resources
- Adaptive Network Optimization for Space-based Tactical Information Distribution (ANOSTID)
- User Regulated Heated Gloves for Aerial Gunners
- Efficient Removal of In-Service Low Observable Materials via Controlled Spot Media Blasting
- Counter-Autonomy through Adversarial Reinforcement Learning
Research funding history
7 SBIR/STTR records share this UEI (2018–2024). Reported award amounts total $6,221,302. Reported amounts are not federal obligations.
Phases: Phase II – Direct to Phase II, Phase II, Phase I
Agencies: Department of Defense, National Science Foundation