Advancing the Manufacturing Readiness of Smart Substrates for System-on-Foil Advanced Packaging

Lux Semiconductors is developing a domestic source of leap-ahead advanced packaging capability, System-on-Foil, for USG and commercial customers. The effort aligns with the U.S. government's priority to strengthen the domestic Printed Circuit Board and Advanced Packaging industrial base, as outlined in the Presidential Determination No. 2023ľ06, Executive Order 14017. System-on-Foil enables a new generation of low SWaP, highly integrated devices with improved bandwidth, capability, functionality, and performance to meet this mission need. This Phase II project focuses on scaling Luxĺs unique Smart Metal Wafer technology to enable a robust, pure-play domestic supply chain for the System-on-Foil advanced packaging capability. This technology addresses critical gaps pertaining to advanced packaging, as identified by the US Air Force and Space Force, including Advanced Substrates, Digital Engineering, and Alternative Manufacturing Sources. This sentiment has been conveyed by leaders across the US government and Defense Industrial Base advanced packaging ecosystem, which has led to significant support and a strategic investment. Lux Semiconductors is poised to contribute significantly to the U.S. military readiness and economic competitiveness through this innovative advanced packaging technology and SBIR Phase II effort. The project scope will consist of four key objectives: Validate 200mm Bare Metal Wafer Manufacturing Processes Develop Fabrication Processes for 200mm Smart Metal Wafers Demonstrate Pilot Production of Smart Metal Wafers Qualify Smart Metal Wafers for Low Volume RDL Manufacturing