Non-Destructive Techniques for Characterization of Defects in Printed RF Materials and Devices (1000-564)

SI2 Technologies, Inc. (SI2) proposes to develop a protocol—based on non-destructive techniques—to quantify the impact of manufacturing defects on the RF performance of printed antennas, waveguides and other additively manufactured (AM) RF devices. SI2 will utilize its in-house capabilities in RF design, RF and electronics testing, and AM to develop these non-destructive RF measurement techniques. Specifically, SI2 will employ a variety of printed RF structures to characterize multiple defect types. In Phase I, SI2 will measure the baseline performance of printed RF devices and deviations from this baseline attributable to printing defects. This will support initial development of an RF model to predict and reduce the impact of defects on printed antennas. In Phase II, SI2 will carry out environmental and high power testing of printed antenna systems composed of the optimized RF components developed in Phase I. SI2 will work with MDA and industry partners to identify technology transition opportunities for these printed antenna systems. Approved for Public Release | 20-MDA-10643 (3 Dec 20)