Reverse Engineering, Manufacturing, and SAR for NSN 5998-01-276-2156

TAF proposes to Reverse Engineer the McNab Circuit Card Assembly, NSN identified by DLA, 5998-01-276-2156, using available adjacent and salvaged parts. TAF will create a Technical Data Package (TDP), manufacture and test prototypes, develop a Source Approval Request package, and ultimately deliver 5-10 working sample parts for Source Approval. The NSN is a critical Circuit Card Assembly — more commonly referred to as a Printed Circuit Board Assembly (PCBA) — in the system that measures propeller shaft torque on Ohio-Class SSBNs.      TAF’s has a successful history of Reverse Engineering and Manufacturing similar types of components. TAF’s methodology will be based on past successes reverse engineering lithium battery Printed Circuit Board Assemblies (PCBAs) for DLA. In addition, TAF successfully “black box” reverse engineered similar parts to the NSN. “Black box” reverse engineering is where the design is discovered based only on surrounding devices without access to the actual unit. Once a SAR is approved, TAF will participate as an Approved Source for the specific NSN in future procurements.