SBIR/STTR Research Award
Advanced Integrated Circuit Anti-Tamper Methods
Award amount
$749,877Program and phase
SBIR · Phase IIAward year
2012Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- NEXGENSEMI CORPORATION
- Proposal award date
- 2012-01-18
- Contract end date
- Not reported
- UEI
- GQSJQMBAEJ79
- Solicitation number
- 2010.3
- Topic code
- AF103-184
Research abstract
ABSTRACT: NexGenSemi will develop a unique semiconductor split fabrication process to execute multiple AT techniques into the wafer. During the phase I program, NexGenSemi perform preliminary sub 90nm tests leading to manufacturing and test. During the phase II effort, NexGenSemi will team with a US Trusted Foundry to demonstrate AT techniques providing a solution to a broader range of manufacturing. BENEFIT: Provide the DOD and Intel Agencies a high speed, low cost Trusted AT manufacturing method for electornics below the 90nm technology node.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Additive Manufacturing Rad Hard Microshields (AMRM)
- Advanced Microelectronic Manufacturing Program (AMMP)
- 3D Printed Microscale Radiation Shield
- Resonating Acoustic Vector Integrated Nanoribbon (RAVIN)
- Materials and Life Cycle Sustainability
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Advanced Integrated Circuit Anti-Tamper Methods (configurable AT focus)
- Advanced Integrated Circuit Anti-Tamper Methods
- Development of an Ultra-Low Power IC Design and Packaging Technique to Provide a Variety of Critical Anti-Tamper Safeguards
- Advanced Integrated Circuit Anti-Tamper Methods
Research funding history
13 SBIR/STTR records share this UEI (2009–2023). Reported award amounts total $3,518,921. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense