FEOL & BEOL PARTITIONING

Alphacore proposes Dr. Yago Gonzalez-Velo as the principal investigator (PI) for this SBIR program. Dr. Gonzalez-Velo has experience ranging from radiation effects, characterization to implementation of novel technologies in the BEOL of CMOS circuits. Dr Gonzalez Velo has gained experience in BEOL layer design, as well as photolithography mask design, and MEMS manufacturing experience through different research works related to the integration of ReRAM and nano-ionics micro-electro-mechanical-systems (MEMS) in the BEOL. He is also familiar with the Cadence design flow used for microelectronic design and different ph.  Dr. Gonzalez-Velo would be assisted by Dr. E. Mikkola who is an experienced circuit designer in rad-hard electronics IC design for ADC, image sensor circuits and different type of read-out-ICs.  Alphacore has identified and contacted BRIDG (https://gobridg.com/) as an implementation partner for this work, with Alphacore leading the design of the test chip, the development of the methodology flow for gds-II files partitioning and test chip testing, and BRIDG being the demonstrator facility to conduct the wafer bonding. Dr John Allgair, program manager at BRIDG and expert in wafer processing and in manufacturing techniques for advanced technology nodes and wafer stacking will be providing