Packaging High Temperature Electronics by Direct Write Additive Manufacturing Method

Microcvd Corporation proposes a direct-write laser chemical vapor deposition (LCVD) additive manufacturing (AM) method to attach, connect, and protect high temperature electronics die packaging and to maintain suitable thermal protection, mechanical robustness, radiation resistance, and reliable electrical connectivity across a wide range of operating temperatures. The proposed direct write AM technology will allow simultaneous conductive line circuit fabrication, electronic component printing (such as resistor, capacitor, inductor, radio frequency (RF) antenna, sensors, etc.), protective radiation layer formation, printing of thermal/cooling structures, substrate die attachment, and multiple-layer deposition from different materials within one working chamber by switching different chemical precursors. This will ultimately reduce cost and shorten delivery time of the final packaged product. Approved for Public Release | 22-MDA-11215 (27 Jul 22)