Packaging and Assemblies for High-temperature Intelligent Aerospace Controls

Continuing from the success of the Phase I project to develop a low-cost, fast-turnaround platform for extreme environments (temperatures >200 Celsius, high vibration), this Phase II project will demonstrate this platform in a real-world application for distributed engine control. To get a meaningful functioning platform as soon as possible, the Smart Sensing Node from the Air Force-commissioned Distributed Engine Control system has been divided into 2 generations: The first generation will use currently-available silicon-on-insulator parts (which will operate to 200 C), while the second generation will use higher-temperature silicon-carbide parts (which will operate to 300 C and higher). The first generation will have 2 prototypes: the first demonstrate the majority of analog sensing functions and data conversion (Year 1) while the second prototype will add on-board processing and communication (Year 2). To achieve its goals, the platform uses a software design system (created and proven in Phase I) that allows for the interactive and simultaneous design and verification of parts and integrated circuits together with the design of the platform. This design system reduces turnaround time and costs by removing interface errors and eliminating re-spins. As well, special fabrication techniques reduce turnaround time (< 1 week) and cost (40% reduction).