SBIR/STTR Research Award
LTCC Packaging and Assemblies for Low-Cost, Reliable, High-temperature Intelligent Aerospace Controls
Award amount
$149,875Program and phase
STTR · Phase IAward year
2016Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- OZARK INTEGRATED CIRCUITS INC
- Proposal award date
- 2016-07-14
- Contract end date
- 2017-04-17
- UEI
- C3JNF19C7DK8
- Solicitation number
- 2016.0
- Topic code
- AF16-AT17
Research abstract
The Air Force needs distributed modules that will work reliably in extreme environments (temperatures >200 Celsius, high vibration). A low-cost, rapid-turnaround platform for the assembly of these modules for these environments is required. This will be ...
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- High-Temperature Flow Rate Instrument for Geothermal Reservoir Monitoring
- Packaging Methods for Reliable and Scalable High Temperature Electronics
- System Integration of Non-Volatile Ferroelectric Memory for High Temperature Applications
- High-Temperature Flow Rate Instrument for Geothermal Reservoir Monitoring
- A 4H-SiC Thin-Film Process for the Manufacture of UV-Detecting VISIR-Blind Integrated Circuits
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Packaging and Assemblies for High-temperature Intelligent Aerospace Controls
- Increased High-Temperature Reliability for Die Extraction and Reassembly
- Affordable Integrated Circuit Packaging and Assembly for High-Temperature Intelligent Components
Research funding history
37 SBIR/STTR records share this UEI (2012–2024). Reported award amounts total $19,866,110. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Energy, National Aeronautics and Space Administration, Department of Defense, National Science Foundation