SBIR/STTR Research Award
Increased High-Temperature Reliability for Die Extraction and Reassembly
Award amount
$150,000Program and phase
STTR · Phase IAward year
2016Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- GLOBAL CIRCUIT INNOVATIONS INC
- Proposal award date
- 2016-06-24
- Contract end date
- 2017-03-30
- UEI
- E652EP6DMVA7
- Solicitation number
- 2016.0
- Topic code
- AF16-AT17
Research abstract
Global Circuit Innovations (GCIs) die extraction and reassembly technology(DER) generated initial interest in and demand by the commercial industry through demonstrating the value of remanufacturing an original integrated circuit (IC) from a plas...
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- New Source of Supply for Legacy Components with DoD Requirements
- Reverse Engineering of NSN 5998-00-338-7373 and NSN 5998-01-348-7781
- NSN 5998-00-338-7373 and NSN 5998-01-374-2558 Reverse Engineering
- Reverse Engineering of Sole Source Components
- Engineering Solution for Obsolete Parts for F-35: E1G44HT Quad Port Gigabit Ethernet CCA and 92-506510-007-S001A Backplane CCA.
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Packaging and Assemblies for High-temperature Intelligent Aerospace Controls
- Affordable Integrated Circuit Packaging and Assembly for High-Temperature Intelligent Components
- LTCC Packaging and Assemblies for Low-Cost, Reliable, High-temperature Intelligent Aerospace Controls
Research funding history
27 SBIR/STTR records share this UEI (2016–2024). Reported award amounts total $10,340,209. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense