SBIR/STTR Research Award
Affordable Integrated Circuit Packaging and Assembly for High-Temperature Intelligent Components
Award amount
$149,982Program and phase
STTR · Phase IAward year
2016Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- MICROELECTRONICS RESEARCH DEVELOPMENT CORPORATION
- Proposal award date
- 2016-06-29
- Contract end date
- 2017-03-30
- UEI
- M2WCCD39B593
- Solicitation number
- 2016.0
- Topic code
- AF16-AT17
Research abstract
Micro-RDC proposes to demonstrate the feasibility of developing low-cost, low-weight, reliable packaging materials and processes to produce low-power advanced Integrated Circuits (ICs) that can operate continuously at temperatures between -55C and +225...
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Low Cost Methodology to Radiation Hardening of Legacy Integrated Circuits
- Low-Cost, Quick-Turn Radiation Tolerant Encryption Engine
- Innovative Mitigation of Radiation Effects in Advanced Technology Nodes
- Double Data Rate 3 Controller for Use in Radiation Environments
- An AMBA-Compliant, Radiation Tolerant Tensor Core for Use in A.I. Applications
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Packaging and Assemblies for High-temperature Intelligent Aerospace Controls
- Increased High-Temperature Reliability for Die Extraction and Reassembly
- LTCC Packaging and Assemblies for Low-Cost, Reliable, High-temperature Intelligent Aerospace Controls
Research funding history
45 SBIR/STTR records share this UEI (2006–2019). Reported award amounts total $31,438,573. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration