Solid State High Power Amplifier for Communications

ENGIN-IC, Inc. proposes to develop a highly efficient, linear K-Band solid state power amplifier (SSPA) to support missile defense communications.The proposed SSPA will be developed with a modular approach that can be scaled to support output power requirements for multiple applications.The heart of the modules is an integrated Monolithic Microwave Integrated Circuit(MMIC) that utilizes a GaN process.This MMIC incorporates inverse class F matching to achieve high output stage power-added efficiency.Through use of a traveling wave divider-combiner circuit, four of these MMICs are combined to form the standard building block module.This combiner is realized using a waveguide structure to provide high efficiency (low insertion loss) and provides an optimum spacing between the MMIC heat sources to facilitate cooling.These attributes are incorporated together into a low cost modular packaging approach that offers excellent thermal performance. Single sub-modules can be hot-swapped in / out of the transmitter for repair or replacement.(Approved for Public Release 15-MDA-8482 (17 November 15))