High Resolution Three-Dimensional Digital Reconstruction of Integrated Circuits

MaXentric is pursuing a hybrid non-destructive approach to 3D imaging and reconstruction of very small geometry integrated circuits (ICs). We are combining advanced phase contrast x-ray imaging and computed tomography techniques to identify the 3D structure of the IC with a non-intrusive high-resolution multi-probe near-field technique to capture the active interconnections and devices of the IC. This will be a powerful tool in the reverse engineering of ICs as well as for fault analysis, in that the unused or inactive devices in the circuit can be identified. The functionally of the different elements of a circuit will be illustrated with this technique allowing for clear reconstruction of the operation of the circuit in addition to its 3D structure. Additionally, this technique has implications for the characterization of device interactions in a circuit and will provide an avenue for the optimization of the performance of the IC. The non-destructive approach will greatly increase the throughput of the resolution processing system as no material removal is necessary, while providing an accurate and precise analysis of the IC.