Integrated Circuit Engineering for Chip-Level Obfuscation Using Diverse Suppliers (ICE-CLOUDS)

To meet the demands of N252-102 Hardware-Level, Reverse-Engineering Resistant Logic Designs for Standard Complementary Metal-Oxide-Semiconductor (CMOS) Processes program, the MaXentric Technologies, Prof. Boris Vaisband and Prof. Nader Sehatbakhsh team proposes the ICE-CLOUDS (Integrated Circuit Engineering for Chip-Level Obfuscation Using Diverse Suppliers) solution, which provides secure IC design metrology for chiplet-based ASICs. The emergence of new integration technologies has created a new opportunity to revisit the existing assumptions and strategies. Exploiting the chiplet paradigm-shift, a comprehensive split fabrication strategy is employed that includes an IP block is split both vertically and horizontally, resulting in significant security improvement while exhibiting minimal overhead. During Phase I works, the team will evaluate the proposed hybrid split manufacturing methodology in terms of image-base, side-channel, and other attacks.Ý In addition, overhead of the proposed solution will be estimated. During Phase II works, a prototype will be demonstrated using the proposed and baseline metrologies. The proposed solution will contribute to a future secure ASIC design flow.Ý