Innovative Manufacturing Process Improvements (Bulk)

Silicon Space Technology (with LSI Logic and Jazz Semiconductor) proposes to demonstrate an innovative manufacturing process technology implementing our hardened-by-isolation (HBI) approach for near-term insertion into BMD discrete components. We will develop scaleable bulk test circuit elements using 130 nm technology enhanced by SEE and TID mitigation process modules supporting radiation-hardening and cryogenic performance of components fabricated in commercial foundries. Extensive modeling and simulation will demonstrate performance and radiation hardness in Phase I. Our team's expertise in commercial process integration, device development in leading-edge commercial technology, and radiation-hardening techniques using HBP technology is crucial to successful implementation of the radiation-hardened process modules. Silicon Space's HBI approach, combined with leading-edge silicon foundry manufacturing, provides fabrication processes enhancing capabilities, product quality and reliability, manufacturing yields and sub-systems and component performance while reducing unit costs, cycle time, and process variability. These innovations solve the pervasive design, fabrication, and sustainment manufacturing problems experienced by Ballistic Missile Defense System (BMDS). This program will allow rapid transition of the results into systems and subsystems being developed for the BMDS. Leading-edge CMOS foundries producing these products will achieve the previously unattainable goal of deploying the latest electronics while minimizing risk of mission failure due to space radiation.