Low-Power, Rad-hard Reconfigurable, Bi-directional Flexfet¿ Level Shifter ReBiLS for Multiple Generation Technology Integration for Space Exploration
Award amount
$599,909Program and phase
SBIR · Phase IIAward year
2006Award details
- Awarding agency
- National Aeronautics and Space Administration
- Branch
- Not reported
- Recipient company
- AMERICAN SEMICONDUCTOR, INC
- Proposal award date
- 2005-12-20
- Contract end date
- 2007-12-19
- UEI
- C1BNR9HJBQK8
- Solicitation number
- Not reported
- Topic code
- S1.04
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Ultra-thin Conformal Electronic System Development and Characterization
- ForeWarm: FHE Microclimate Heating System for Strength and Dexterity
- ForeWarm: FHE Microclimate Heating System for Strength and Dexterity
- Enabling Flexible Materials, Devices and Processes for Defense
- FleX-3D Wafer Processing for Chip Stacking and Interconnect
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- A Silicon Carbide Foundry for NASA's UV and High Temperature CMOS Electronics Needs
- VLWIR Sensors for Detecting and Tracking Near-Earth Asteroids
- Tunable, High-Power Terahertz Quantum Cascade Laser Local Oscillator
- Wafer level Integration on PolyStrata(R) Interposer (WIPI) (17013)
- A Low Power Rad-Hard ADC for the KID Readout Electronics
Research funding history
22 SBIR/STTR records share this UEI (2002–2025). Reported award amounts total $8,230,994. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration