Large Area, Bump Bondable, InAlAs APD arrays fro 3-D eye-safe LADAR Applications

Solid State Scientific Corporation (SSSC) proposes to design, fabricate and test a 256 x256 array of InGaAs/InAlAs based avalanche photodiodes (APDs) for Munitions Directorate, eye-safe, staring 3-D LADAR receiver applications. This high gain array will have all front-side fabrication completed as a full wafer process from commercially available, ultra-uniform, 3" epitaxial grown material. The final array will be designed as a backside illuminated device and as such will require backside processing after the full wafer is diced into individual arrays. Backside processing will include thinning, backside AR coating and backside alignment and metallization. Statistical test methods will be used to determine yield of the 65k pixel array and it will be suitable for bump bonding once complete.