Optimized Multi-Spectral Digital Pixel Readout IC

There is industry demand for a multi-spectral infrared camera that has improved discrimination of narrow spectral bands and offers both higher charge handling capability and higher sensitivity than conventional analog pixels are able to support. We will build an innovative digital pixel readout integrated circuit (DPROIC) that is optimized to support multi-spectral and hyper-spectral imaging and make it commercially available to all of the multi-spectral focal plane and camera vendors. The DPROIC shall be suitable for SWIR, MWIR, LWIR, VLWIR or broad-band detectors covering multiple infrared regions and contain specific features designed to support narrow-band filtering over both low (SWIR) or high (LWIR and VLWIR) background signals. This unique integrated circuit shall include a number of features and operating modes specifically intended to enhance multi-spectral performance and be attractive to both commercial and DoD community. These include: •           Capable of supporting detectors with a broad spectral range from SWIR to VLWIR •           Stitched architecture to create multiple small and large formats in support of the widest range of staring and scanning multi-spectral implementations •           Programmable row skipping for cross-row filter optimization •           Programmable gain control by row for optimal SNR match-up to spectral signal •           Implants to immunize DPROIC against single event latch-up •           Designed-in hooks to the base design so that triple modular redundancy can be implemented quickly and easily, thus offering the option of single-event effect radiation-tolerant versions of the DPROIC for the Air Force and national space community   A primary innovation in this project shall be the multi-spectral-optimized digital pixel. We are proposing a Capacitive Transimpedance Amplifier Input (CTIA) based digital pixel circuit that enables both high-gain operation for SWIR detectors and also has a very large well capacity for use with MWIR and LWIR detectors, yet is compatible with large stitched chip fabrication. At the end of the Phase I, Senseeker will have detailed target applications, DPROIC specifications and established partnerships for hybridization and multi-spectral camera demonstration. Two preliminary pixel designs shall be completed in two different CMOS processes with a recommendation for which path to take in Phase II. If chosen for a Phase II, Senseeker will work with an appropriate partner to demonstrate operation of the optimized multi-spectral DPROIC in a multi-spectral camera.