Automated Measurement of Passive Devices in Printed Circuit Assemblies
Award amount
$98,638Program and phase
STTR · Phase IAward year
2024Award details
- Awarding agency
- Department of Defense
- Branch
- Defense Microelectronics Activity
- Recipient company
- TDA RESEARCH, INC.
- Proposal award date
- 2024-02-21
- Contract end date
- 2024-05-21
- UEI
- MK5ANJVWVZK7
- Solicitation number
- 23.C
- Topic code
- DMEA23C-P001
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Corrosion and wear resistant coating for rotary engine seals and surfaces
- Chip Scale Oceanographic Sensor
- Corrosion inhibiting high temperature coating
- Enhanced Sensory Perception Via Advanced Synthetic Skin
- Automated Measurement of Passive Devices in Printed Circuit Assemblies
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- AI-enabled Automated PCB Analysis and Reverse Engineering Using Data Augmentation
- REvision: multimodal reverse engineering and device characterization
- Artificial Intelligence-Supported Software Solutions for Optimized Microelectronics Sustainment
- Silkscreen Text Identification of Circuit Card Assemblies by Optical Character Recognition for AutoBOM Extraction
Research funding history
951 SBIR/STTR records share this UEI (1988–2026). Reported award amounts total $317,960,224. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration, Environmental Protection Agency, National Science Foundation, Department of Health and Human Services