SBIR/STTR Research Award

AI-enabled Automated PCB Analysis and Reverse Engineering Using Data Augmentation

Award identifier 8ae1745dbe2d4fa078cbb10adc8af7e7c3174c76720ac4e35a858f8f661dd497Awarding agency Department of Defense · Defense Microelectronics Activity

Award amount

$98,620

Program and phase

STTR · Phase I

Award year

2024

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Award details

Awarding agency
Department of Defense
Branch
Defense Microelectronics Activity
Recipient company
AEROCYONICS, INC.
Proposal award date
2024-01-25
Contract end date
2024-04-30
UEI
TJW5NDLH8TN1
Solicitation number
23.C
Topic code
DMEA23C-P001

Research abstract

In the realm of microelectronics, particularly when dealing with printed circuit board assemblies (PCBAs), the challenges of obsolescence and the need for efficient reverse engineering solutions have become increasingly apparent. These challenges resonate across government agencies, including the Department of Defense (DoD), and various industries that heavily rely on microelectronics to ensure the functionality of their systems. Given these shared challenges, the quest for innovative technologies to enhance PCB analysis and re-engineering processes has become imperative. Automation solutions that leverage deep learning are promising but must contend with the limitations of dataset availability. Approaches like data augmentation, which involve the creation of new training examples through transformations and not through creating new data, only offer a partial remedy. The proposed Phase I research intends to explore the viability of creating an AI-driven automated reverse engineering method for PCBAs. Our primary focus is on overcoming the challenge of having a restricted training dataset for deep learning algorithms. Our approach involves generating synthetic X-ray images, which will serve as crucial reference data for training these deep learning algorithms. Additionally, our algorithms will be addressing common X-ray imaging artifacts including beam hardening and scattering, planarity of layers and image distortion and potential motion artifacts during long X-ray scans. The ultimate objective is to equip these algorithms with the capability to autonomously and efficiently segment PCB images and convert them to an open ASCII vector format such as Gerber format that can be used for the production of PCBs. The technique will be initially used on PCBs without components but at the next step will be expanded to the PCBAs that have components on them. The quality and the accuracy of the proposed method will be benchmarked against a complete destructive reverse engineering approach.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

3 SBIR/STTR records share this UEI (2020–2024). Reported award amounts total $433,075. Reported amounts are not federal obligations.

Phases: Phase I

Agencies: Department of Defense

Agency intelligence

Department of Defense

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