SBIR/STTR Research Award
Automated Measurement of Passive Devices in Printed Circuit Assemblies
Award amount
$1,315,121Program and phase
SBIR · Phase IIAward year
2025Award details
- Awarding agency
- Department of Defense
- Branch
- Defense Microelectronics Activity
- Recipient company
- TDA RESEARCH, INC.
- Proposal award date
- 2024-12-16
- Contract end date
- 2027-02-02
- UEI
- MK5ANJVWVZK7
- Solicitation number
- 23.C
- Topic code
- DMEA23C-P001
Research abstract
TDA proposes to develop a device to automatically remove and isolate the passive components on a PCB so that their properties (Inductance (L), capacitance (C), and resistance (R), (LCR)) can be easily and accurately measured. TDA’s system, titled AMPD (Automated Measurement of Passive Devices), desolders all passive components from a PCB and moves them to isolated pads so that their LCR values can be measured without interference from other components. AMPD then generates a record of where each component came from on the original PCB, its new location, and a series of pictures verifying the process. TDA’s AMPD system will significantly improve the ability to evaluate legacy or unknown printed circuit assemblies, speeding up this slow, error prone, and expensive process.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Corrosion and wear resistant coating for rotary engine seals and surfaces
- SBIR TOPIC 111, PHASE II: A COMPACT PORTABLE MEDICAL OXYGEN GENERATOR
- A Mobile Application for Prediction of Blast Overpressure Exposure in Civilian and Military Operations
- Low-Temperature Secondary Batteries for the Lunar Surface
- Lunar Surface Secondary Battery Modules for Continuous Day/Night Operation
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- AI-enabled Automated PCB Analysis and Reverse Engineering Using Data Augmentation
- REvision: multimodal reverse engineering and device characterization
- Artificial Intelligence-Supported Software Solutions for Optimized Microelectronics Sustainment
- Automated Measurement of Passive Devices in Printed Circuit Assemblies
- Silkscreen Text Identification of Circuit Card Assemblies by Optical Character Recognition for AutoBOM Extraction
Research funding history
951 SBIR/STTR records share this UEI (1988–2026). Reported award amounts total $317,960,224. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration, Environmental Protection Agency, National Science Foundation, Department of Health and Human Services