SBIR/STTR Research Award
REvision: multimodal reverse engineering and device characterization
Award amount
$98,576Program and phase
STTR · Phase IAward year
2024Award details
- Awarding agency
- Department of Defense
- Branch
- Defense Microelectronics Activity
- Recipient company
- TerraVerum LLC
- Proposal award date
- 2024-01-26
- Contract end date
- 2024-04-30
- UEI
- VEZSKN7RSA83
- Solicitation number
- 23.C
- Topic code
- DMEA23C-P001
Research abstract
The Defense industry frequently grapples with aging legacy systems that lack accessible source documents for reference during updates, repairs, or maintenance. Even when intellectual property (IP) is available, manufacturers may cease to supply the necessary parts. While reverse engineering (RE) is a viable solution, manual RE is cost-prohibitive and prone to errors. Therefore, automation is paramount, reducing the technical burden on operators. To this end, we propose the REvision project to automate aspects of multimodal PCB assembly (PCBA) reverse engineering. REvision focuses on integrating our published innovations in automated PCB vision analysis into a physical inspection pipeline which generates a BoM. REvision complements this optical workflow with volumetric netlist analysis using X-ray CT scans after layer-wise dewarping. We unify optical and X-ray workflows in Phases 2 and 3 leading to multimodal, auto-generated netlists and Gerber files.
Technology keywords
Not reported
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
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