SBIR/STTR Research Award

REvision: multimodal reverse engineering and device characterization

Award identifier c500f53fdff875a10ef1f218b063f6e037160e1912c19948ac2a6eaf357aa782Awarding agency Department of Defense · Defense Microelectronics Activity

Award amount

$98,576

Program and phase

STTR · Phase I

Award year

2024

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Award details

Awarding agency
Department of Defense
Branch
Defense Microelectronics Activity
Recipient company
TerraVerum LLC
Proposal award date
2024-01-26
Contract end date
2024-04-30
UEI
VEZSKN7RSA83
Solicitation number
23.C
Topic code
DMEA23C-P001

Research abstract

The Defense industry frequently grapples with aging legacy systems that lack accessible source documents for reference during updates, repairs, or maintenance. Even when intellectual property (IP) is available, manufacturers may cease to supply the necessary parts. While reverse engineering (RE) is a viable solution, manual RE is cost-prohibitive and prone to errors. Therefore, automation is paramount, reducing the technical burden on operators. To this end, we propose the REvision project to automate aspects of multimodal PCB assembly (PCBA) reverse engineering. REvision focuses on integrating our published innovations in automated PCB vision analysis into a physical inspection pipeline which generates a BoM. REvision complements this optical workflow with volumetric netlist analysis using X-ray CT scans after layer-wise dewarping. We unify optical and X-ray workflows in Phases 2 and 3 leading to multimodal, auto-generated netlists and Gerber files.

Technology keywords

Not reported

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Agency intelligence

Department of Defense

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