SBIR/STTR Research Award
Artificial Intelligence-Supported Software Solutions for Optimized Microelectronics Sustainment
Award amount
$96,632Program and phase
STTR · Phase IAward year
2024Award details
- Awarding agency
- Department of Defense
- Branch
- Defense Microelectronics Activity
- Recipient company
- ELEVAN LLC
- Proposal award date
- 2024-02-20
- Contract end date
- 2024-05-20
- UEI
- LS7EKXC4VV25
- Solicitation number
- 23.C
- Topic code
- DMEA23C-P001
Research abstract
DoD weapons systems rely heavily on microelectronics to function; however, the access to the technical data to sustain these critical design elements is limited. The Defense Microelectronics Activity (DMEA) has a need for technologies to assist in the process of extracting a printed circuit board design non-destructively from a printed circuit board assembly. To meet this need, Elevate proposes to adapt their 2D-to-2D analysis and conversion platform for use in microelectronics sustainment workflows. In this Phase I effort, Elevate will evaluate the feasibility of their technology to address DMEA's challenges related to visual recognition and inspection, bill of materials construction, design extraction, layer extraction of warped PCB boards with reconstruction artifacts, and other challenges.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Innovative Solutions for Legacy Systems Modernization Using Plastic Additive Manufacturing
- AI Supported Reverse Engineering Technology Platform
- Using Artificial Intelligence to Increase Aircraft Parts Availability with Additive Manufacturing
- Leveraging AI/ML to Expedite Aircraft Replacement Parts
- AI-Supported System for Identifying and Evaluating Suitable Additive Manufacturing Candidates
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Automated Measurement of Passive Devices in Printed Circuit Assemblies
- AI-enabled Automated PCB Analysis and Reverse Engineering Using Data Augmentation
- REvision: multimodal reverse engineering and device characterization
- Automated Measurement of Passive Devices in Printed Circuit Assemblies
- Silkscreen Text Identification of Circuit Card Assemblies by Optical Character Recognition for AutoBOM Extraction
Research funding history
14 SBIR/STTR records share this UEI (2020–2025). Reported award amounts total $7,409,597. Reported amounts are not federal obligations.
Phases: Phase I, Phase II – Direct to Phase II, Phase II
Agencies: Department of Defense