High Temperature Packaging and Electronics for Harsh Airborne Applications

Temperature hardened electronics are being developed for harsh airborne applications. To complement these efforts, high temperature packaging studies need to follow suit. To address this problem, the proposed work covers an initial feasibility analysis of high temperature compatible materials and substrates for long term use as circuit boards, interconnects and attach material. Additionally, the proposed work covers an exploratory set of small-scale experiments and a proof-of-concept demonstration. More specifically, the work is divided into four tasks that focus on a) high temperature compatible material selection and physics simulations, b) investigation of our existing silicon carbide devices for ultra-high temperature applications, c) building a small-scale proof-of-concept prototype, and d) plans for the follow-up Phase II. In summation, the project is built on a well-rounded approach of “design for manufacturing” and ‘design for reliability” for the development of high temperature packaging and associated electronics. Approved for Public Release | 22-MDA-11215 (27 Jul 22)