SBIR/STTR Research Award
Packaging Methods for Reliable and Scalable High Temperature Electronics
Award amount
$154,949Program and phase
SBIR · Phase IAward year
2022Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- OZARK INTEGRATED CIRCUITS INC
- Proposal award date
- 2022-07-25
- Contract end date
- 2023-01-24
- UEI
- C3JNF19C7DK8
- Solicitation number
- 22.1
- Topic code
- MDA22-008
Research abstract
In conjunction with the USAF, Ozark IC has developed packaging systems based on silicon (Si) and silicon-on-insulator (SOI) components for advanced control of turbine engines. A clear opportunity exists to evaluate and improve Ozark IC’s packaging systems, demonstrated from 200C to 800C for extreme vibration and shock to meet missile interceptor requirements. This can be accomplished through use of unique attachment materials and development of predicative models – based on measurement and characterization of these materials. The proposed systems also offer scalability in terms of manufacturing; they can utilize 3D printing systems for rapid prototyping, while using materials compatible with production methods for mass production. Approved for Public Release | 22-MDA-11215 (27 Jul 22)
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- High-Temperature Flow Rate Instrument for Geothermal Reservoir Monitoring
- Packaging Methods for Reliable and Scalable High Temperature Electronics
- System Integration of Non-Volatile Ferroelectric Memory for High Temperature Applications
- High-Temperature Flow Rate Instrument for Geothermal Reservoir Monitoring
- A 4H-SiC Thin-Film Process for the Manufacture of UV-Detecting VISIR-Blind Integrated Circuits
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Hybrid Electronics Packaging Platform for Extreme Environment Microelectronic Components
- Hybrid Electronics Packaging Platform for Extreme Environment Microelectronic Components
- High Temperature Packaging and Electronics for Harsh Airborne Applications
- Packaging High Temperature Electronics by Direct Write Additive Manufacturing Method
Research funding history
37 SBIR/STTR records share this UEI (2012–2024). Reported award amounts total $19,866,110. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Energy, National Aeronautics and Space Administration, Department of Defense, National Science Foundation