Hybrid Electronics Packaging Platform for Extreme Environment Microelectronic Components

As foreign adversaries continue the rapid development and deployment of hypersonic weapons, the US DoD is determined to achieve quick results in the field. Accordingly, the DoD is pursuing multiple competing efforts to be placed on a streamlined course through rapid prototyping and testing, followed by rapid production and deployment. Air vehicles moving through the atmosphere at hypersonic speeds provide multiple challenges for electronics, including extreme levels of heat, vibration, and shock and the electronics onboard a missile-defense interceptor must operate in such a harsh environment. These electronics could reach high temperatures due to aero-heating, self-heating, and/or proximity to a propulsion system. High temperatures degrade electrical performance of such electronic systems and weaken their ability to withstand mechanical and chemical stresses. Conventional silicon-based electronics fail above a certain temperature. Insulation, isolation, and/or cooling could help protect these electronics, but these protective measures also complicate the interceptor's design and increases its size, weight, and power (SWaP). To address this problem, the Missile Defense Agency has identified the need to develop advanced packaging techniques for high temperature electronics in harsh flight environments that will extend the upper limit of operating temperature to minimize the need for these protective measures. There are many complex integration challenges that must be overcome to maintain suitable thermal, mechanical, and electrical connections across a wide range of operating temperatures. Of particular interest is the ability to attach and connect a high temperature die to its package. Accordingly, International FemtoScience Inc. (FemtoSci) proposes a High Temperature Electronics (HTE) packaging system approach that continues the development of the temperature, shock, and vibration averse Advanced Diamond Metal Matrix Braze (ADMMB) die attach material system, and also proposes 3D integrated Additively Manufactured (AM) ceramic substrates, advanced electrical interconnection technologies, and High Temperature Silicon Carbide electronic circuit demonstrators. International FemtoScience (FemtoSci) will perform research to design, develop, and test the HTE packaging system approach that continues the development of HTE die attach systems, ceramic hybrid circuit boards, advanced interconnection mechanisms, and demonstratable application of these technologies to first-of-its-kind Silicon Carbide Integrated Circuit components. With the proposed HTE packaging system complex, Silicon Carbide Integrated Circuit technology may begin transition into Original Equipment Manufacturers for prototype demonstration before the conclusion of the Phase II effort, drastically expediting transition of fieldable HTE systems into hypersonic arms applications. Approved for Public Release | 23-MDA-11635 (9 Nov 23)