Design and Fabrication of Novel Radiation Immune Vacuum Microelectronic Devices and Circuits

The DoD has identified a need to develop radiation hardened electronic components capable of surviving and operating through exposure to radiation environments encountered in space. To protect these electronic components, systems typically employ a combination of methods for radiation protection. International FemtoScience (FemtoSci) proposes a practical solution to produce Inherently Radiation Hardened Microelectronic Components by employing diamond emitter vacuum device technology. The proposed device technology is insensitive to all levels and all types of natural space and man-caused radiation and therefore requires little to no radiation protection. In Phase II, FemtoSci will perform research and development to optimize the device technology demonstrated in Phase I to improve baseline performance, increase survivability and level of operability in realistic radiation environments. FemtoSci will fabricate and test optimized parts in mission equivalent radiation conditions and against standard military temperature cycling specifications. FemtoSci will work with commercialization partner, Moog, to assure the manufacturability and producibility of the proposed devices and to incorporate the technology in a representative space avionic subsystem/system application. Approved for Public Release | 22-MDA-11215 (27 Jul 22)