Advanced Unidirectional Compliant Electronic Interconnect for Reliable Ultrafine Pitch Microelectronic Systems

The United States and Department of Defense have an urgent national security need to be able to domestically produce secure, next generation semiconductors and integrated electronics to be used in a range of defense and commercial applications such as unmanned aerial vehicles, aircraft systems, and weapons systems. Building on their Phase I success, SunRay Scientific will demonstrate in Phase II their Anisotropic Conductive Epoxy, or ZTACH® ACE, as a robust and scalable electronic interconnect solution for compact, low loss, high-isolation, and tightly integrated operational electronic systems spanning 1-90 GHz frequency range. SunRay Scientific and Teledyne Judson Technologies will continue to examine the potential cost advantages of using ZTACH® ACE instead of the traditional indium bump- bonding. This Phase II project will seek to improve yield at finer pad pitch as well as demonstrate high interconnect yield (> 99%), with high density pitch (30-micron pitch), across a die area greater than or equal to 1 cm square. SunRay Scientific will deliver to the Air Force ZTACH® ACE interconnected test structures, integrated functional operations test, comprehensive device characterization, and parametric tests as well as comprehensive test results, evaluations, and recommendations including associated costs, benefits, and the ability to manufacture at high volumes.