A Modular, High-Efficiency, Radiation-Hardened, DC-DC Converter with Decentralized Control
Award amount
$124,953Program and phase
SBIR · Phase IAward year
2020Award details
- Awarding agency
- National Aeronautics and Space Administration
- Branch
- Not reported
- Recipient company
- APOGEE SEMICONDUCTOR, INC.
- Proposal award date
- 2020-08-20
- Contract end date
- 2021-03-01
- UEI
- SQ3NLYSGDAW7
- Solicitation number
- SBIR_20_P1
- Topic code
- Z1
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- SBIR Phase II: Low-Cost Packaging Solution for Space-Grade and High-Reliability Integrated Circuits
- Radiation Hardened Integrated Circuit Fabrication Process Design Kit for Advanced Cryogenic Imagers
- STTR Phase I:Low-Cost Packaging Solution for Space-Grade and High-Reliability Integrated Circuits
- A Modular, High-Efficiency, Radiation-Hardened, DC-DC Converter with Decentralized Control
- Cryogenic Radiation-Hard Read-out Integrated Circuit Electronics Process Design Kit
Research funding history
12 SBIR/STTR records share this UEI (2014–2024). Reported award amounts total $6,475,305. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Defense, National Science Foundation, National Aeronautics and Space Administration, Department of Energy